Tao-Chih Chang : rechercher sur Z-Library

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1

Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test

Hung-Jen Chang, Tao-Chih Chang, Chau-Jie Zhan, Jung-Hua Chou

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 967 KB

english, 2011

2

Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology

Shen, Wen-Wei, Lin, Yu-Min, Wu, Sheng-Tsai, Lee, Chia-Hsin, Huang, Shin-Yi, Chang, Hsiang-Hung, Chang, Tao-Chih, Chen, Kuan-Neng

Journal:

Journal of Nanoscience and Nanotechnology

Année:

2018

Langue:

english

Fichier:

PDF, 15.29 MB

english, 2018

3

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications

Lin, Yu-Min, Wu, Sheng-Tsai, Wang, Chun-Min, Lee, Chia-Hsin, Huang, Shin-Yi, Lin, Ang-Ying, Chang, Tao-Chih, Lin, Puru Bruce, Ko, Cheng-Ta, Chen, Yu-Hua, Su, Jay, Liu, Xiao, Prenger, Luke, Chen, Kuan-

Année:

2019

Langue:

english

Fichier:

PDF, 840 KB

english, 2019

4

Packaging reliability estimation of high-power device modules by utilizing silver sintering technology

Lee, Chang-Chun, Kuo, Kuo-Shu, Wang, Chi-Wei, Chang, Jing-Yao, Han, Wei-Kuo, Chang, Tao-Chih

Journal:

Microelectronics Reliability

Année:

2020

Fichier:

PDF, 670 KB

2020

5

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Chang, Hung-Jen, Zhan, Chau-Jie, Chang, Tao-Chih, Chou, Jung-Hua

Journal:

Journal of Electronic Packaging

Année:

2012

Langue:

english

Fichier:

PDF, 3.12 MB

english, 2012

6

Influence of underfill materials on the reliability of coreless flip chip package

Chun-Chih Chuang, Tsung-Fu Yang, Jin-Ye Juang, Yin-Po Hung, Chau-Jie Zhan, Yu-Min Lin, Ching-Tsung Lin, Pei-Chen Chang, Tao-Chih Chang

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 903 KB

english, 2008

7

Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages

Tung-Han Chuang, Chih-Yuan Cheng, Tao-Chih Chang

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 587 KB

english, 2009

8

Intermetallic compounds formation and interfacial adhesion strength of Sn–9Zn–0.5Ag solder alloy hot-dipped on Cu substrate

Tao-Chih Chang, Min-Hsiung Hon, Moo-Chin Wang

Journal:

Journal of Alloys and Compounds

Année:

2003

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2003

9

Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Jing-Yao Chang, Ren-Shin Cheng, Kuo-Shu Kao, Tao-Chih Chang, Tung-Han Chuang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2012

Langue:

english

Fichier:

PDF, 2.67 MB

english, 2012

10

Evaluation of Strain Measurement in a Die-to-Interposer Chip UsingIn SituSynchrotron X-Ray Diffraction and Finite-Element Analysis

Hsu, Hsueh-Hsien, Chiu, Tz-Cheng, Chang, Tao-Chih, Huang, Shin-Yi, Lee, Hsin-Yi, Ku, Ching-Shun, Lin, Yang-Yi, Su, Chien-Hao, Chou, Li-Wei, Ouyang, Yao-Tsung, Huang, YI-Ting, Wu, Albert T.

Journal:

Journal of Electronic Materials

Année:

2014

Langue:

english

Fichier:

PDF, 261 KB

english, 2014

11

Investigation of pre-bending substrate design in packaging assembly of an IGBT power module

Lee, Chang-Chun, Kao, Kuo-Shu, Lin, Leon, Chang, Jing-Yao, Leu, Fang-Jun, Lu, Yu-Lan, Chang, Tao-Chih

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 3.49 MB

english, 2014

12

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Next Standard Packaging Method for DRAM - Chip-in-Substrate Package

Ko, Cheng-ta, Chang, Tao-chih, Chiang, Chia-wen, Kuo, Tzu-ying, Shih, Ying-ching, Chen, Yu-hua

Année:

2006

Langue:

english

Fichier:

PDF, 5.79 MB

english, 2006

13

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Huang, Shin-Yi, Chang, Tao-Chih, Cheng, Ren-Shin, Chang, Jing-Yao, Fan, Chia-Wen, Zhan, Chau-Jie, Lau, John H., Chen, Tai-Hong, Lo, Wei-Chung, Kao, Ming-Jer

Année:

2011

Langue:

english

Fichier:

PDF, 1.57 MB

english, 2011

14

An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate

Chang, Jing-Yao, Chaung, Tung-Han, Chang, Tao-Chih

Journal:

Journal of Electronic Materials

Année:

2015

Langue:

english

Fichier:

PDF, 1.96 MB

english, 2015

15

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Chang, Jing-Yao, Huang, Shin-Yi, Lee, Chang-Chun, Chuang, Tung-Han, Chang, Tao-Chih

Journal:

Journal of Electronic Packaging

Année:

2015

Langue:

english

Fichier:

PDF, 2.10 MB

english, 2015

16

The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

Lee, Christine Jill, Chen, Wei-Yu, Chou, Tzu-Ting, Lee, Tae-Kyu, Wu, Yew-Chung, Chang, Tao-Chih, Duh, Jenq-Gong

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 4.68 MB

english, 2015

17

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Chang, Hung-Jen, Chou, Jung-Hua, Chang, Tao-Chih, Zhan, Chau-Jie, Hon, Min-Hsiung, Hsi, Chi-Shiung

Journal:

Journal of Electronic Packaging

Année:

2011

Langue:

english

Fichier:

PDF, 2.59 MB

english, 2011

18

Effect of a Phase Formation on Mechanical Properties of Stainless Steel SUS309L after Isothermal Aging

Lin, Dong-Yih, Chang, Tao-Chih

Journal:

steel research international

Année:

2004

Langue:

english

Fichier:

PDF, 1.07 MB

english, 2004

19

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Reliability performance of 30μm-pitch solder micro bump fluxless bonding interconnections

Huang, Shin-Yi, Chang, Tao-Chih, Lin, Yu-Min, Chung, Su-Ching, Fun, Su-Yu

Année:

2018

Langue:

english

Fichier:

PDF, 597 KB

english, 2018

20

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

Lin, Yu-Min, Wu, Sheng-Tsai, Shen, Wen-Wei, Huang, Shin-Yi, Kuo, Tzu-Ying, Lin, Ang-Ying, Chang, Tao-Chih, Chang, Hsiang-Hung, Lee, Shu-Man, Lee, Chia-Hsin, Su, Jay, Liu, Xiao, Wu, Qi, Chen, Kuan-Neng

Année:

2018

Langue:

english

Fichier:

PDF, 696 KB

english, 2018

21

Synthesis of Nanosized Chitosan-Poly(acrylic acid) Particles by a Dropping Method

Tao-Chih Chang, Jian-Wen Wang, Min-Hsiung Hon

Journal:

Macromolecular Bioscience

Année:

2004

Langue:

english

Fichier:

PDF, 226 KB

english, 2004

22

Morphology and adhesion strength of the Sn–9Zn–3.5Ag/Cu interface after aging

Tao-Chih Chang, Moo-Chin Wang, Min-Hsiung Hon

Journal:

Journal of Crystal Growth

Année:

2004

Langue:

english

Fichier:

PDF, 754 KB

english, 2004

23

Microstructure and adhesion strength of Sn–9Zn–xAg lead-free solders wetted on Cu substrate

Tao-Chih Chang, Shih-Min Chou, Min-Hsiung Hon, Moo-Chin Wang

Journal:

Materials Science and Engineering: A

Année:

2006

Langue:

english

Fichier:

PDF, 760 KB

english, 2006

24

Microstructural evolution during the δ/σ/γ phase transformation of the SUS 309LSi stainless steel after aging under various nitrogen atmospheric ratios

Chih-Chun Hsieh, Dong-Yih Lin, Tao-Chih Chang

Journal:

Materials Science and Engineering: A

Année:

2008

Langue:

english

Fichier:

PDF, 2.03 MB

english, 2008

25

Effect of aging on the growth of intermetallic compounds at the interface of Sn–9Zn–xAg/Cu substrates

Tao-Chih Chang, Moo-Chin Wang, Min-Hsiung Hon

Journal:

Journal of Crystal Growth

Année:

2003

Langue:

english

Fichier:

PDF, 711 KB

english, 2003

26

Crystal growth of the intermetallic compounds at the Sn–9Zn–xAg/Cu interface during isothermal aging

Tao-Chih Chang, Moo-Chin Wang, Min-Hsiung Hon

Journal:

Journal of Crystal Growth

Année:

2003

Langue:

english

Fichier:

PDF, 903 KB

english, 2003

27

Influence of Si content on the intergranular corrosion of SUS 309L stainless steels

Dong-Yih Lin, Tao-Chih Chang

Journal:

Materials Science and Engineering: A

Année:

2003

Langue:

english

Fichier:

PDF, 1.48 MB

english, 2003

28

Precipitation behavior of σ phase in fusion zone of dissimilar stainless steel welds during multi-pass GTAW process

Chih-Chun Hsieh, Tao-Chih Chang, Dong-Yih Lin, Ming-Che Chen, Weite Wu

Journal:

Metals and Materials International

Année:

2007

Langue:

english

Fichier:

PDF, 1021 KB

english, 2007

29

Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate

Tao-Chih Chang, Moo-Chin Wang, Min-Hsiung Hon

Journal:

Metallurgical and Materials Transactions A

Année:

2005

Langue:

english

Fichier:

PDF, 575 KB

english, 2005

30

Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads

Chi-Shiung Hsi, Ching-Tsung Lin, Tao-Chih Chang, Moo-Chin Wang, Ming-Kann Liang

Journal:

Metallurgical and Materials Transactions A

Année:

2010

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2010

31

Adhesion strength of the Sn-9Zn-xAg/Cu interface

Tao-Chih Chang, Min-Hsiung Hon, Moo-Chin Wang

Journal:

Journal of Electronic Materials

Année:

2003

Langue:

english

Fichier:

PDF, 619 KB

english, 2003

32

Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn–9Zn–xAg/Cu interface

Tao-Chih Chang, Moo-Chin Wang, Min-Hsiung Hon

Journal:

Journal of Crystal Growth

Année:

2003

Langue:

english

Fichier:

PDF, 848 KB

english, 2003

33

Intermetallic compounds formed at the interface between Cu substrate and an Sn–9Zn–0.5Ag lead-free solder

Tao-Chih Chang, Min-Hsiung Hon, Moo-Chin Wang

Journal:

Materials Research Bulletin

Année:

2003

Langue:

english

Fichier:

PDF, 227 KB

english, 2003

34

Effect of Si contents on the growth behavior of σ phase in SUS 309L stainless steels

Dong-Yih Lin, Tao-Chih Chang, Guan Ling Liu

Journal:

Scripta Materialia

Année:

2003

Langue:

english

Fichier:

PDF, 322 KB

english, 2003

35

Kinetics of intermetallic compound formation at 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface

Moo-Chin Wang, Shan-Pu Yu, Tao-Chih Chang, Min-Hsiung Hon

Journal:

Journal of Alloys and Compounds

Année:

2004

Langue:

english

Fichier:

PDF, 224 KB

english, 2004

36

Formation and morphology of the intermetallic compounds formed at the 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface

Moo-Chin Wang, Shan-Pu Yu, Tao-Chih Chang, Min-Hsiung Hon

Journal:

Journal of Alloys and Compounds

Année:

2005

Langue:

english

Fichier:

PDF, 367 KB

english, 2005

37

Growth and morphology of the intermetallic compounds formed at the Sn–9Zn–2.5Ag/Cu interface

Tao-Chih Chang, Moo-Chin Wang, Min-Hsiung Hon

Journal:

Journal of Alloys and Compounds

Année:

2005

Langue:

english

Fichier:

PDF, 431 KB

english, 2005

38

Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate: Part 1. Thermal properties, microstructure, corrosion and oxidation resistance

Tao-Chih Chang, Jian-Wen Wang, Moo-Chin Wang, Min-Hsiung Hon

Journal:

Journal of Alloys and Compounds

Année:

2006

Langue:

english

Fichier:

PDF, 418 KB

english, 2006

39

Phase transformation and morphology of the intermetallic compounds formed at the Sn–9Zn–3.5Ag/Cu interface in aging

Min-Hsiung Hon, Tao-Chih Chang, Moo-Chin Wang

Journal:

Journal of Alloys and Compounds

Année:

2008

Langue:

english

Fichier:

PDF, 2.06 MB

english, 2008

40

Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards

Ching-Tsung Lin, Chi-Shiung Hsi, Moo-Chin Wang, Tao-Chih Chang, Ming-Kann Liang

Journal:

Journal of Alloys and Compounds

Année:

2008

Langue:

english

Fichier:

PDF, 1.95 MB

english, 2008

41

Enhancement of the wettability and solder joint reliability at the Sn–9Zn–0.5Ag lead-free solder alloy–Cu interface by Ag precoating

Tao-Chih Chang, Ying-Tun Hsu, Min-Hsiung Hon, Moo-Chin Wang

Journal:

Journal of Alloys and Compounds

Année:

2003

Langue:

english

Fichier:

PDF, 1.43 MB

english, 2003

42

Reliability enhancements of chip-on-chip package with layout designs of microbumps

Lee, Chang-Chun, Kao, Kuo-Shu, Cheng, Ren-Shin, Zhan, Chau-Jie, Chang, Tao-Chih

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 2.75 MB

english, 2014

43

Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits

Ouyang, Fan-Yi, Jhu, Wei-Cheng, Chang, Tao-Chih

Journal:

Journal of Alloys and Compounds

Année:

2013

Langue:

english

Fichier:

PDF, 1.91 MB

english, 2013

44

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application

Chien, Chien-Wei, Shen, Li-Cheng, Chang, Tao-Chih, Chang, Chin-Yao, Leu, Fang-Jun, Yang, Tsung-Fu, Ko, Cheng-Ta, Lee, Ching-Kuan, Shu, Chao-Kai, Lee, Yuan-Chang, Shih, Ying-Ching

Année:

2007

Langue:

english

Fichier:

PDF, 4.08 MB

english, 2007

45

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance

Li-Cheng Shen,, Wen-Chih Chen,, Yin-Po Hung,, Tsung-Fu Yang,, Fang-Jun Leu,, Tao-Chih Chang,

Année:

2008

Langue:

english

Fichier:

PDF, 1.00 MB

english, 2008

46

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Characteristics of 600 V / 450 A IGBT module assembled by Ag sintering technology

Chang, Jing-Yao, Su-Yu Fun,, Leu, Fang-Jun, Kao, Kuo-Shu, Chih-Ming Tzeng,, Wei-Kuo Han,, Chang, Tao-Chih

Année:

2014

Langue:

english

Fichier:

PDF, 564 KB

english, 2014

47

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Photovoltaic modules of crystalline solar cells using a new type assembly structure

Hsieh, Hsin-Hsin, Lee, Wen-Kuei, Chang, Tao-Chih, Hsi, Chi-Shiung

Année:

2010

Langue:

english

Fichier:

PDF, 504 KB

english, 2010

48

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Process characteristics of a 2.5D silicon module using embedded technology as a feasible solution for system integration and thinner form-factor

Cheng, Ren-Shin, Hung, Yin-Po, Kuo, Tzu-Ying, Lin, Yu-Min, Leu, Fan-Jun, Chang, Tao-Chih

Année:

2013

Langue:

english

Fichier:

PDF, 1.58 MB

english, 2013

49

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Influence of surface morphology on the adhesion strength of plated Cu on the build-up layer within an embedded active package

Huang, Yu-Wei, Hung, Yin-Po, Cheng, Ren-Shin, Chang, Tao-Chih, Lee, Ching-Kuan, Chen, Tai-Hong

Année:

2010

Langue:

english

Fichier:

PDF, 249 KB

english, 2010

50

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Reliability assessment of the 20 um pitch micro-joints within a 3DIC assembly under various environments

Huang, Shin-Yi, Chang, Tao-Chih, Cheng, Ren-Shin, Chang, Jing-Yao, Leu, Fang-Jun, Lu, Yu-Lan, Yang, Tsung-Fu

Année:

2010

Langue:

english

Fichier:

PDF, 3.22 MB

english, 2010